Make : Bungard Electronik Gmbh & Co.
Features:
- The maximum size of the PCB that can be milled: At least 229 mm x 305 mm
- X/Y travel speed: At least 145mm/sec or more
- Mechanical Resolution: 0.5µm or better
- Spindle Speed : Upto 60000 rpm,with integrated automatic milling depth adjustment sensor with ± 1µm and self cleaning features
- Drill: Min hole dia 0.15 mm, drilling Speed 60000 rpm
- Drilling Speed: 100 drills/minute or more
- Isolation and Track width: Machine should be capable of making tracks and isolation upto 0.1mm (4mil)
- Capable to make single side/ double side and multilayer circuits on FR4, FR3, RT/ Duroid, Kapton, LTCC (unfired) and polyamide stencil, special films, aluminium panel engraving etc.
- uEye Camera: 5MPix; Resolution: 2592 x 1944, Magnification: 30X
- Camera for fiducial/Optical mark recognition, alignment, Automatic offset correction as well as drill bit inspection.
Location of the Instrument: Sahyadri Campus, Dr.APJ Abdul Kalam Block, MMIC Lab, Ground Floor
Current Status of the Instrument : Under Maintenance
Sample Submission Form Internal Users