The mask aligner can demarcate micrometer-scale patterns onto the substrate using photolithography. This system is capable of performing multilevel photolithography on top and bottom side of substrates.
Location: Manogatha, Workshop 3, Nila Campus
Model: MA6/BA6 SUSS MicroTec
Equipment Capabilities:
Micrometer-scale patterns onto the substrate using photolithography
Top and Bottom side alignment
365 nm (i-line), 405 nm (g-line) and 248 nm (DUV) available.
Status of the Instrument : Active