The mask aligner can demarcate micrometer-scale patterns onto the substrate using photolithography. This system is capable of performing multilevel photolithography on top and bottom side of substrates.

Mask Aligner


Location: Manogatha, Workshop 3, Nila Campus

Model: MA6/BA6  SUSS MicroTec


Equipment Capabilities:

Micrometer-scale patterns onto the substrate using photolithography

Top and Bottom side alignment 

365 nm (i-line), 405 nm (g-line) and 248 nm (DUV) available. 


Status of the Instrument : Active

Sample Submission Form (For Internal Users)