The HB 05 is a manual bench top wire bonder. It can perform ball/wedge or wedge/wedge bonding by a simple change of the tool head.  The equipment is attached with a heating stage which can allow temperature control up to 250C.


Model:  TPT -HB05

1 Manual Wedge Wire Bonder with adjustable height (60mm)
2 Heater stage (250 degree Celsius)
3  Bond using Aluminium (Al) or Gold(Au) wires

For bonding the devices with the measurement pad

Status of the Instrument : Active

Location of the Instrument : Nila Campus , IIT Palakkad

Regular Measurements :


Sample Submission Form (Internal Users)



For Slot booking (Internal users)