The HB 05 is a manual bench top wire bonder. It can perform ball/wedge or wedge/wedge bonding by a simple change of the tool head. The equipment is attached with a heating stage which can allow temperature control up to 250C.
Model: TPT -HB05
| 1 | Manual Wedge Wire Bonder with adjustable height (60mm) |
| 2 | Heater stage (250 degree Celsius) |
| 3 | Bond using Aluminium (Al) or Gold(Au) wires |
| 4 |
For bonding the devices with the measurement pad |
Status of the Instrument : Active
Location of the Instrument : Nila Campus , IIT Palakkad
Regular Measurements :
Sample Submission Form (Internal Users)
For Slot booking (Internal users)
https://my.labagenda.com/